Green Movement
- industry drives towards “green” or leadfree electronic products
- affected are: lead base tin in semiconductor components
- market pressure and legal restrictions are forcing the implementation of green packages
- legal restraints for using dangerous materials in electronic devices become a worldwide phenomenon
Conventional contact fingers will lead to drastic increase in final test cost.
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Leadfree Material
- Leadframe and Area Array Packages (QFN, QFP, SO, TSSOP, BGA….)
- PdNi (Palladium Nickel)
- Sn100 (100% Tin)
- SnAgCu (Tin Silver Copper)
- SnBi (Tin Bismut)
- others, not specified
Impact of new platings on contacts performance
- Pd based material, preplated leadframe (PdNi)
- Pd (Palladium) is much harder than Sn (Tin) therefore increases wear on contact fingers
- oxidation of the contact fingers base material causes contact resistance increase > degradation of 1st pass yield
- Sn (Tin) based materials (Sn100, SnAgCu and SnBi)
- Sn (Tin) transfere and accumulate from package to contact fingers, also known as solder migration
- Sn (Tin) on gold contact surfaces causes deterioration of contact resistance > degradation of 1st pass yield
- frequent cleaning cycles > increased downtime and potential damage of contact fingers