Green Challenge




GREEN CHALLENGE

Green Movement

* industry drives towards “green” or leadfree electronic products
* affected are: lead base tin in semiconductor components
* market pressure and legal restrictions are forcing the implementation of green packages
* legal restraints for using dangerous materials in electronic devices become a worldwide phenomenon


Leadfree Material

* Leadframe and Area Array Packages (QFN, QFP, SO, TSSOP, BGA….)
* PdNi (Palladium Nickel)
* Sn100 (100% Tin)
* SnAgCu (Tin Silver Copper)
* SnBi (Tin Bismut)
* others, not specified


Impact of new platings on contacts performance

* Pd based material, preplated leadframe (PdNi)
* Pd (Palladium) is much harder than Sn (Tin) therefore increases wear on contact fingers
* oxidation of the contact fingers base material causes contact resistance increase > degradation of 1st pass yield
* Sn (Tin) based materials (Sn100, SnAgCu and SnBi)
* Sn (Tin) transfere and accumulate from package to contact fingers, also known as solder migration
* Sn (Tin) on gold contact surfaces causes deterioration of contact resistance > degradation of 1st pass yield
* frequent cleaning cycles > increased downtime and potential damage of contact fingers


Conventional contact fingers will lead to drastic increase in final test cost.
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