GREEN CHALLENGE
Green Movement
* industry drives towards “green” or leadfree electronic products
* affected are: lead base tin in semiconductor components
* market pressure and legal restrictions are forcing the implementation of green packages
* legal restraints for using dangerous materials in electronic devices become a worldwide phenomenon
Leadfree Material
* Leadframe and Area Array Packages (QFN, QFP, SO, TSSOP, BGA….)
* PdNi (Palladium Nickel)
* Sn100 (100% Tin)
* SnAgCu (Tin Silver Copper)
* SnBi (Tin Bismut)
* others, not specified
Impact of new platings on contacts performance
* Pd based material, preplated leadframe (PdNi)
* Pd (Palladium) is much harder than Sn (Tin) therefore increases wear on contact fingers
* oxidation of the contact fingers base material causes contact resistance increase > degradation of 1st pass yield
* Sn (Tin) based materials (Sn100, SnAgCu and SnBi)
* Sn (Tin) transfere and accumulate from package to contact fingers, also known as solder migration
* Sn (Tin) on gold contact surfaces causes deterioration of contact resistance > degradation of 1st pass yield
* frequent cleaning cycles > increased downtime and potential damage of contact fingers
Conventional contact fingers will lead to drastic increase in final test cost.
Do CONTACT US for our proven solution. Thank you.
Green Movement
* industry drives towards “green” or leadfree electronic products
* affected are: lead base tin in semiconductor components
* market pressure and legal restrictions are forcing the implementation of green packages
* legal restraints for using dangerous materials in electronic devices become a worldwide phenomenon
Leadfree Material
* Leadframe and Area Array Packages (QFN, QFP, SO, TSSOP, BGA….)
* PdNi (Palladium Nickel)
* Sn100 (100% Tin)
* SnAgCu (Tin Silver Copper)
* SnBi (Tin Bismut)
* others, not specified
Impact of new platings on contacts performance
* Pd based material, preplated leadframe (PdNi)
* Pd (Palladium) is much harder than Sn (Tin) therefore increases wear on contact fingers
* oxidation of the contact fingers base material causes contact resistance increase > degradation of 1st pass yield
* Sn (Tin) based materials (Sn100, SnAgCu and SnBi)
* Sn (Tin) transfere and accumulate from package to contact fingers, also known as solder migration
* Sn (Tin) on gold contact surfaces causes deterioration of contact resistance > degradation of 1st pass yield
* frequent cleaning cycles > increased downtime and potential damage of contact fingers
Conventional contact fingers will lead to drastic increase in final test cost.
Do CONTACT US for our proven solution. Thank you.